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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9576925 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Sep. 30, 2015

Semiconductor device having a cylindrical shaped conductive portion

Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Nobuto Managaki, Kawasaki, JP;

Hiroshi Yamada, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 25/10 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/11 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 23/5226 (2013.01); H01L 23/5386 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1183 (2013.01); H01L 2224/11823 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13553 (2013.01); H01L 2224/13564 (2013.01);
Abstract

A semiconductor device includes a first conductive portion, a second conductive portion, a first layer, and a second layer. The first conductive portion includes a first end portion and a first extending portion. The first extending portion extends in a first direction. The length of the first extending portion in a second direction is shorter than a length of at least a part of the first end portion in the second direction. The first layer includes multiple semiconductor chips, multiple passive chip components, and a resin. The first extending portion includes a first portion and a second portion. The first layer is provided around the first portion. The first layer expands along a first plane. The first plane intersects the first direction. The second layer includes a first multilayer wiring. The second layer expands along a second plane intersecting the first direction.

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