The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Jun. 20, 2011
Claus Reitlinger, Wolnzach, DE;
Frank Rehme, Einhausen, DE;
Rudolf Bart, Taufkirchen, DE;
EPCOS AG, Munich, DE;
Abstract
The invention relates to a module package which comprises a module substrate, a chipapplied using the flip chip process, and an encapsulation layer, and to a method for producing same. The chiphas component structures on the top sidethereof. Said top saidfaces the module carrier, wherein a gapis formed between the top sideof the chip and the module carrier. A filler is added to the encapsulation layer. The encapsulation layerpartly fills underneath the chip, wherein at most the part of the chip, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layercompletely encloses the sides of the chip