The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Sep. 16, 2015
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Elena Becerra Woodard, Filmore, CA (US);

Daniel Kwadwo Amponsah Berkoh, West Hills, CA (US);

David James Zapp;

Steve Canale, Simi Valley, CA (US);

Hyong Yong Lee, Thousand Oaks, CA (US);

Daniel E. Sanchez, Camarillo, CA (US);

Hung V. Phan, Simi Valley, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/683 (2006.01); B32B 43/00 (2006.01); B23Q 3/08 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B23Q 3/084 (2013.01); B32B 43/006 (2013.01); H01L 21/67092 (2013.01); H01L 21/6835 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1933 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1978 (2015.01); Y10T 428/21 (2015.01); Y10T 428/219 (2015.01);
Abstract

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.


Find Patent Forward Citations

Loading…