The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Mar. 27, 2014
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Fumio Watanabe, Tokyo, JP;

Naozumi Ishikawa, Tokyo, JP;

Hiroshi Kamiyama, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01L 27/08 (2006.01); H01L 21/20 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); C25D 5/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 17/0013 (2013.01); H01F 41/042 (2013.01); C25D 5/022 (2013.01); H01F 2017/0066 (2013.01);
Abstract

A coil componentincludes a thin-film coil layer including spiral conductors and bump electrodestoformed on a surface of the thin-film coil layer. The thin-film coil layer includes internal terminal electrodestoconnected respectively to corresponding one ends of the spiral conductors, and a fourth insulating layercovering the internal terminal electrodetoand having openings ha to hd. Both a top surface TS and a side surface SS of each of the internal terminal electrodestoare exposed through the corresponding opening. The bump electrodestoare each brought into contact with both the top surface TS and side surface SS of each of the internal terminal electrodestoin the corresponding opening.


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