The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Dec. 24, 2013
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

William F. Edwards, Livermore, CA (US);

George Edward Curtis, San Jose, CA (US);

Ki Yuen Chau, Palo Alto, CA (US);

Sandeep Arvindkumar Patel, Los Gatos, CA (US);

Keith Frank Tharp, San Jose, CA (US);

Robin Carol Johnson, Boulder Creek, CA (US);

Yu Liu, Pleasanton, CA (US);

Billie Alton Hudson, Sadler, TX (US);

Assignee:

CISCO TECHNOLOGY, INC, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/04 (2006.01); H01F 27/06 (2006.01); H01F 17/06 (2006.01); H01F 27/30 (2006.01); H01R 13/719 (2011.01); H01R 13/66 (2006.01); H01F 17/00 (2006.01); H01R 13/6461 (2011.01);
U.S. Cl.
CPC ...
H01F 27/04 (2013.01); H01F 17/062 (2013.01); H01F 27/027 (2013.01); H01F 27/06 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/306 (2013.01); H01R 13/719 (2013.01); H01F 2017/0093 (2013.01); H01F 2027/065 (2013.01); H01F 2027/297 (2013.01); H01R 13/6461 (2013.01); H01R 13/6633 (2013.01);
Abstract

The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.


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