logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9576693 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Sep. 10, 2012

Metal material for electronic component and method for manufacturing the same

Applicants:

Yoshitaka Shibuya, Ibaraki, JP;

Kazuhiko Fukamachi, Ibaraki, JP;

Atsushi Kodama, Ibaraki, JP;

Inventors:

Yoshitaka Shibuya, Ibaraki, JP;

Kazuhiko Fukamachi, Ibaraki, JP;

Atsushi Kodama, Ibaraki, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Daniel J Schleis

Int. Cl.
CPC ...
B32B 15/00 (2006.01); H01B 1/02 (2006.01); B32B 15/01 (2006.01); C25D 5/10 (2006.01); C22C 5/06 (2006.01); C22C 5/08 (2006.01); C22C 5/10 (2006.01); C22C 9/00 (2006.01); C22C 9/02 (2006.01); C22C 9/04 (2006.01); C22C 13/00 (2006.01); C22C 19/03 (2006.01); C22C 19/07 (2006.01); C22C 22/00 (2006.01); C22C 27/06 (2006.01); C22C 38/00 (2006.01); C22C 13/02 (2006.01); H05K 3/24 (2006.01); C25D 5/50 (2006.01); C25D 5/12 (2006.01); C23C 18/16 (2006.01); H05K 1/11 (2006.01); H01R 13/03 (2006.01); C25D 3/12 (2006.01); C25D 3/20 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 3/50 (2006.01); C25D 3/56 (2006.01); C25D 3/62 (2006.01); C25D 3/64 (2006.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); B32B 15/01 (2013.01); B32B 15/018 (2013.01); C22C 5/06 (2013.01); C22C 5/08 (2013.01); C22C 5/10 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); C22C 9/04 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); C22C 19/03 (2013.01); C22C 19/07 (2013.01); C22C 22/00 (2013.01); C22C 27/06 (2013.01); C22C 38/00 (2013.01); C23C 18/1651 (2013.01); C23C 18/1692 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/505 (2013.01); H05K 3/244 (2013.01); C25D 3/12 (2013.01); C25D 3/20 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 3/50 (2013.01); C25D 3/567 (2013.01); C25D 3/62 (2013.01); C25D 3/64 (2013.01); H01R 13/03 (2013.01); H05K 1/117 (2013.01); H05K 1/118 (2013.01); H05K 2201/0341 (2013.01); Y10T 428/12681 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01);
Abstract

There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal materialfor electronic components has a base material, an A layerconstituting a surface layer on the base materialand formed of Sn, In or an alloy thereof, and a B layerconstituting a middle layer provided between the base materialand the A layerand formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer)has a thickness of 0.002 to 0.2 μm, and the middle layer (B layer)has a thickness of 0.001 to 0.3 μm.

Find Patent Forward Citations

Quick Actions:

Shibuya, Yoshitaka. (2017). Metal material for electronic component and method for manufacturing the same (U.S. Patent No. 9576693). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9576693

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…