The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Dec. 28, 2012
Applicants:

Enplas Corporation, Kawaguchi-shi, Saitama, JP;

Tomoegawa Co., Ltd., Chuo-ku, Tokyo, JP;

Inventors:

Masahiro Tanazawa, Kawaguchi, JP;

Shimpei Morioka, Kawaguchi, JP;

Makoto Goto, Shizuoka, JP;

Nobuhiro Hashimoto, Shizuoka, JP;

Assignees:

ENPLAS CORPORATION, Kawaguchi-shi, JP;

TOMOEGAWA CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); G02B 7/00 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); G02B 3/00 (2006.01); G02B 6/38 (2006.01); G02B 6/42 (2006.01); G02B 6/32 (2006.01);
U.S. Cl.
CPC ...
G02B 7/004 (2013.01); B32B 38/10 (2013.01); B32B 43/00 (2013.01); G02B 3/0012 (2013.01); G02B 3/0056 (2013.01); G02B 3/0075 (2013.01); G02B 6/32 (2013.01); G02B 6/3845 (2013.01); G02B 6/3885 (2013.01); G02B 6/4204 (2013.01); G02B 6/4249 (2013.01); Y10T 156/1089 (2015.01); Y10T 156/1195 (2015.01);
Abstract

A lens array fabrication method for fabricating a lens array includes: receiving pins of a film attaching instrument (jig) in second guide holes of a film-containing base plate; bonding a placement area and an adhesion layer (F); removing the pins; causing a detachment between a first detachment film (C) and a pressure-sensitive adhesive optical film (D); separating three layers (D) to (F) from two layers (B) and (C); receiving the pins in first guide holes of a lens array main unit; fitting a film holding protrusion in a depression part; bonding the film (D) to a bonding region (i); removing the pins; and causing a detachment between the film (D) and a second detachment film (E).


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