The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Feb. 27, 2015
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventor:

Mitsuhiro Ito, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01D 46/24 (2006.01); F01N 3/022 (2006.01); C04B 28/24 (2006.01); C04B 35/565 (2006.01); C04B 37/00 (2006.01); C04B 38/00 (2006.01); C04B 41/85 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); C04B 111/00 (2006.01); C04B 111/32 (2006.01); C04B 111/34 (2006.01);
U.S. Cl.
CPC ...
F01N 3/0222 (2013.01); B01D 46/2418 (2013.01); B01D 46/2429 (2013.01); B01D 46/2444 (2013.01); B01D 46/2448 (2013.01); C04B 28/24 (2013.01); C04B 35/565 (2013.01); C04B 37/005 (2013.01); C04B 38/0006 (2013.01); C04B 41/009 (2013.01); C04B 41/5089 (2013.01); C04B 41/85 (2013.01); B01D 2046/2496 (2013.01); C04B 2111/0081 (2013.01); C04B 2111/00793 (2013.01); C04B 2111/32 (2013.01); C04B 2111/343 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3481 (2013.01); C04B 2235/5224 (2013.01); C04B 2235/5228 (2013.01); C04B 2235/5232 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/062 (2013.01); C04B 2237/083 (2013.01); C04B 2237/09 (2013.01); C04B 2237/341 (2013.01); C04B 2237/346 (2013.01); C04B 2237/365 (2013.01); Y10T 428/24149 (2015.01);
Abstract

There is provided a honeycomb structure where a crack at honeycomb segments, which constitute a honeycomb bonded assembly, is reduced. A honeycomb structure has a pillar-shaped honeycomb bonded assembly that has a plurality of pillar-shaped honeycomb segments having a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and a bonding layer bonding side surfaces of the plurality of honeycomb segments, and in the honeycomb bonded assembly, at 25 to 800° C., a thermal expansion coefficient of the bonding layer is larger than a thermal expansion coefficient of the honeycomb segment.


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