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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9574253 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Oct. 01, 2012

Aluminum alloy material, aluminum alloy structure, and manufacturing method for same

Applicant:

Uacj Corporation, Chiyoda-Ku, Tokyo, JP;

Inventors:

Akio Niikura, Tokyo, JP;

Kazuko Fujita, Tokyo, JP;

Takashi Murase, Tokyo, JP;

Yoshiyuki Oya, Tokyo, JP;

Tomohito Kurosaki, Tokyo, JP;

Assignee:

UACJ Corporation, Tokyo, JP;

Attorneys:

Carrier Blackman & Associates, P.C.

Joseph P. Carrier

Anne G. Sabourin

Primary Examiner:

Daniel J Schleis

Int. Cl.
CPC ...
B32B 15/01 (2006.01); C22C 21/18 (2006.01); C22C 21/00 (2006.01); C22C 21/02 (2006.01); C22C 21/10 (2006.01); C22F 1/043 (2006.01); F28F 21/08 (2006.01); B23K 20/14 (2006.01); B23K 20/233 (2006.01); C22C 21/04 (2006.01); C22C 21/14 (2006.01); C22C 1/02 (2006.01); C22F 1/00 (2006.01); C22F 1/04 (2006.01); C22F 1/057 (2006.01); F28F 1/02 (2006.01); F28F 1/12 (2006.01);
U.S. Cl.
CPC ...
C22C 21/18 (2013.01); B23K 20/14 (2013.01); B23K 20/2333 (2013.01); B32B 15/016 (2013.01); B32B 15/017 (2013.01); C22C 1/02 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22C 21/04 (2013.01); C22C 21/10 (2013.01); C22C 21/14 (2013.01); C22F 1/043 (2013.01); F28F 21/084 (2013.01); C22F 1/00 (2013.01); C22F 1/04 (2013.01); C22F 1/057 (2013.01); F28F 1/022 (2013.01); F28F 1/126 (2013.01); F28F 2215/00 (2013.01); F28F 2275/04 (2013.01); Y10T 428/12764 (2015.01);
Abstract

An aluminum alloy material contains Si: 1.0 mass % to 5.0 mass % and Fe: 0.01 mass % to 2.0 mass % with balance being Al and inevitable impurities, wherein 250 pcs/mmor more to 7×10pcs/mmor less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material, while 100 pcs/mmto 7×10pcs/mmof Al-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material. An aluminum alloy structure is manufactured by bonding two or more members in vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase generated in the aluminum alloy material to a total mass of the aluminum alloy material is 5% or more and 35% or less.

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