The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Aug. 28, 2009
Applicants:

Mridula Kapur, Lake Jackson, TX (US);

Alan T. Radwanski, Manvel, TX (US);

Inventors:

Mridula Kapur, Lake Jackson, TX (US);

Alan T. Radwanski, Manvel, TX (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 49/06 (2006.01); C08F 10/02 (2006.01); C08L 23/04 (2006.01); C08K 5/00 (2006.01); B29C 49/00 (2006.01); C08K 5/098 (2006.01); C08K 5/20 (2006.01); B29C 37/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C08K 5/0016 (2013.01); B29C 49/0005 (2013.01); C08K 5/098 (2013.01); C08K 5/20 (2013.01); B29C 37/0067 (2013.01); B29C 49/06 (2013.01); B29L 2031/712 (2013.01);
Abstract

The invention provides a process for injection blow molding an article, said process comprising injecting into a mold cavity a composition, comprising at least one ethylene-based polymer and less than, or equal to, 1000 ppm of a mold release agent, based on the total weight of the composition. The invention also provides a composition comprising a blend, wherein the blend comprises at least one high molecular weight (HMW) ethylene-based polymer, and at least one low molecular weight (LMW) ethylene-based polymer, and wherein the blend has an unsaturation level, as determined by IR, and expressed as vinyls per 1000 carbon atoms, less than, or equal to, 0.5 vinyls per 1000 carbon atoms, and wherein the high molecular weight (HMW) ethylene-based polymer has a density from 0.925 to 0.950 g/cc.


Find Patent Forward Citations

Kapur, Mridula. (2017). Processes and compositions for injection blow molding (U.S. Patent No. 9574064). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9574064

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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