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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9574032 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Jan. 14, 2015

Copolymer

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Sung Ho Choi, Daejeon, KR;

Choong Hoon Lee, Daejeon, KR;

Ji Yoon Woo, Daejeon, KR;

Hyo Ju Kim, Daejeon, KR;

Jin Sam Gong, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Kuo-Liang Peng

Int. Cl.
CPC ...
C08F 210/16 (2006.01); C08L 51/00 (2006.01); C08K 5/132 (2006.01); C08K 5/134 (2006.01); C08K 5/52 (2006.01); H01L 31/048 (2014.01); C08J 5/18 (2006.01); H01L 31/18 (2006.01); H01L 31/049 (2014.01); C08L 23/08 (2006.01); C08K 5/544 (2006.01); C08L 23/00 (2006.01); C08F 255/02 (2006.01); C08F 8/42 (2006.01); C08L 51/06 (2006.01); H01L 23/29 (2006.01); C09J 151/06 (2006.01); C08K 5/14 (2006.01); C08K 5/5425 (2006.01); C09D 143/04 (2006.01); C09D 151/06 (2006.01);
U.S. Cl.
CPC ...
C08F 210/16 (2013.01); C08F 8/42 (2013.01); C08F 255/02 (2013.01); C08J 5/18 (2013.01); C08K 5/132 (2013.01); C08K 5/1345 (2013.01); C08K 5/14 (2013.01); C08K 5/52 (2013.01); C08K 5/544 (2013.01); C08K 5/5425 (2013.01); C08L 23/00 (2013.01); C08L 23/08 (2013.01); C08L 23/0815 (2013.01); C08L 51/003 (2013.01); C08L 51/06 (2013.01); C09D 143/04 (2013.01); C09D 151/06 (2013.01); C09J 151/06 (2013.01); H01L 23/29 (2013.01); H01L 23/296 (2013.01); H01L 31/048 (2013.01); H01L 31/049 (2014.12); H01L 31/0481 (2013.01); H01L 31/18 (2013.01); C08J 2323/08 (2013.01); C08J 2451/06 (2013.01); C08L 2203/204 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); H01L 2924/0002 (2013.01); Y02E 10/50 (2013.01);
Abstract

A copolymer, a method of manufacturing a copolymer, an encapsulant for optoelectronic devices, and an optoelectronic device are provided. The encapsulant exhibiting excellent adhesion to front substrates and back sheets included in various optoelectronic devices can be provided. Also, the encapsulant capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated in the optoelectronic device can be provided.

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