The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Dec. 11, 2015
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Shawn Rachelle Markham, Harrodsburg, KY (US);
Windsor Pipes Thomas, III, Painted Post, NY (US);
Assignee:
CORNING INCORPORATED, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03B 33/02 (2006.01); B24B 1/00 (2006.01); B24B 7/22 (2006.01); B24B 37/04 (2012.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); C03B 17/06 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C03B 33/02 (2013.01); B24B 1/00 (2013.01); B24B 7/228 (2013.01); B24B 37/042 (2013.01); C03B 17/064 (2013.01); H01L 21/304 (2013.01); H01L 21/30604 (2013.01); H01L 21/30625 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y02P 40/57 (2015.11); Y10T 428/21 (2015.01); Y10T 428/24628 (2015.01);
Abstract
A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.