The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Feb. 15, 2012
Brian Lee Wardle, Lexington, MA (US);
Fabio Ferruccio Fachin, Cambridge, MA (US);
Stefan Nikles, Cambridge, MA (US);
Mathew Varghese, Los Altos, CA (US);
Brian Lee Wardle, Lexington, MA (US);
Fabio Ferruccio Fachin, Cambridge, MA (US);
Stefan Nikles, Cambridge, MA (US);
Mathew Varghese, Los Altos, CA (US);
Massachusetts Institute of Technology, Cambridge, MA (US);
Abstract
The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.