The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Oct. 20, 2015
Applicant:
Invensense, Inc., San Jose, CA (US);
Inventor:
Thomas M. Goida, Windham, NH (US);
Assignee:
INVENSENSE, INC., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H01L 23/495 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 7/0032 (2013.01); B81B 7/0077 (2013.01); H01L 21/50 (2013.01); H01L 23/495 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/093 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.