The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Oct. 25, 2013
Applicant:

Rolling Optics Ab, Solna, SE;

Inventor:

Axel Lundvall, Bjursås, SE;

Assignee:

Rolling Optics AB, Solina, SE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B29D 11/00 (2006.01); B41F 9/00 (2006.01); B41M 1/00 (2006.01); G02B 3/00 (2006.01); G03F 7/00 (2006.01); B29C 65/00 (2006.01); B41M 1/10 (2006.01);
U.S. Cl.
CPC ...
B32B 37/025 (2013.01); B29D 11/00288 (2013.01); B41F 9/00 (2013.01); B41M 1/10 (2013.01); G02B 3/0031 (2013.01); G03F 7/0002 (2013.01); B32B 2305/72 (2013.01); Y10T 156/17 (2015.01);
Abstract

A method for manufacturing a printed product comprises provision () of a matrix comprising a matrix surface having a plurality of recesses. A first curable compound is applied () to the matrix surface to fill the recesses with the compound. The matrix surface and the filled recesses are covered () by a pickup layer of a second curable compound. The matrix is brought () in contact with the substrate surface and the first curable compound and the second curable compound are cured (). The matrix surface is separated () from the substrate surface, leaving the pickup layer and the first curable compound on the substrate surface. The pickup layer and the first curable compound are thus transferred () together from the matrix surface onto a substrate surface of a substrate sheet. The first curable compound forms printed product micro features at the pickup layer covering the substrate surface.


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