The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Feb. 25, 2015
Applicant:
B/e Aerospace, Inc., Wellington, FL (US);
Inventor:
Alvin S. Bartolome, Eastvale, CA (US);
Assignee:
B/E AEROSPACE, INC., Wellington, FL (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 3/12 (2006.01); B32B 5/02 (2006.01); B32B 27/28 (2006.01); B32B 7/02 (2006.01); B32B 5/12 (2006.01); B32B 5/14 (2006.01); B32B 5/28 (2006.01); B32B 7/04 (2006.01); B32B 27/04 (2006.01); B32B 27/42 (2006.01); B32B 37/14 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
B32B 3/12 (2013.01); B32B 5/02 (2013.01); B32B 5/12 (2013.01); B32B 5/145 (2013.01); B32B 5/28 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 7/045 (2013.01); B32B 27/04 (2013.01); B32B 27/28 (2013.01); B32B 27/42 (2013.01); B32B 37/146 (2013.01); B32B 2037/0092 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2255/02 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2305/076 (2013.01); B32B 2307/718 (2013.01); B32B 2307/738 (2013.01); B32B 2398/10 (2013.01); B32B 2605/18 (2013.01); B32B 2607/00 (2013.01); Y10T 428/2495 (2015.01); Y10T 428/24165 (2015.01);
Abstract
A composite panel includes a honeycomb core sandwiched by a pair of skins that are attached directly to the core with no separate adhesive layer. The skins are impregnated with a resin material that is unevenly distributed between first and second surfaces, and direct contact is established between the surfaces with the greater resin distribution and the core, reducing weight and eliminating the manufacturing step of incorporating an adhesive layer therebetween.