The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Feb. 05, 2008
Applicants:

Shingo Okushima, Tokyo, JP;

Nobuhito Suehira, Kawasaki, JP;

Junichi Seki, Yokohama, JP;

Kazuyuki Kasumi, Utsunomiya, JP;

Inventors:

Shingo Okushima, Tokyo, JP;

Nobuhito Suehira, Kawasaki, JP;

Junichi Seki, Yokohama, JP;

Kazuyuki Kasumi, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); B29C 59/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/002 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); G03F 9/703 (2013.01);
Abstract

An imprinting method in which alignment control of a mold and a substrate is effected and a pattern formed on the mold is transferred onto a pattern forming layer provided on the substrate. The imprinting method includes a step in which the mold and the substrate are brought near to each other while effecting the alignment control, after the alignment control is started, to bring the mold and the pattern forming layer into contact with each other, and then, the pattern forming layer is cured, and a step in which the gap between the mold and the substrate is increased, after the pattern forming layer is cured. Further, the alignment control is stopped after the alignment control is started, and at least one of before and after the mold contacts the pattern forming layer.


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