The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Nov. 13, 2014
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Takaharu Maeguchi, Tokyo, JP;
Takahiro Ota, Tokyo, JP;
Tomoshige Takata, Tokyo, JP;
Hideki Madokoro, Tokyo, JP;
Hiroshi Kanasaki, Tokyo, JP;
Nobuyuki Hori, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A condition setting process of determining peening conditions for water jet peening on a peening target object, an analysis process of analyzing a jet when a liquid is jetted from a nozzle model to a peening target object model and obtaining a void rate that is a volume rate of air bubbles contained in a unit volume of the liquid and a collapse rate that is a volume of the air bubbles collapsing in a unit time in the unit volume of the liquid in each position on a surface of the peening target object model, a shock pressure correlation value calculation process of obtaining a shock pressure correlation value that is a product of the void rate and the collapse rate in each position, and a range calculation process of obtaining an effective processing range in which the shock pressure correlation value on the surface of the peening target object model is greater than a predetermined value, based on the shock pressure correlation value in each position.