The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Nov. 04, 2014
Applicant:

Headway Technologies, Inc., Milpitas, CA (US);

Inventors:

Terry Moore, Mountain View, CA (US);

Brant Nease, Fremont, CA (US);

Assignee:

Headway Technologies, Inc., Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); C03C 25/68 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/311 (2006.01); B24B 37/013 (2012.01); B24B 49/12 (2006.01); H01L 21/321 (2006.01); H01L 21/3105 (2006.01); H01L 21/66 (2006.01); B81C 99/00 (2010.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 49/12 (2013.01); H01L 21/302 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01); B81C 99/0065 (2013.01); B81C 2201/0104 (2013.01);
Abstract

An adaptive feedback control method is provided for a chemical mechanical polish process to minimize a dielectric layer clearing time difference between two annular regions on a substrate. An optical system with an optical window passes below the polishing pad and detects reflected light interference signals from at least two annular regions. A pre-clearing time difference is determined and is used to calculate an adjustment to one or both of a CMP head membrane pressure and a retaining ring pressure. The pressure adjustment is applied before the end of the polish cycle to avoid the need for a second polish cycle and to reduce a dishing difference and a resistance difference in a metal layer in the at least two annular regions. In some embodiments, a second pressure adjustment is performed before the end of the cycle and different CMP head membrane pressure adjustments are made in different pressure zones.


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