The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Aug. 08, 2014
Applicant:

Merlin Solar Technologies, Inc., San Jose, CA (US);

Inventors:

Alejandro de la Fuente Vornbrock, San Carlos, CA (US);

Venkateswaran Subbaraman, San Jose, CA (US);

Assignee:

Merlin Solar Technologies, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/08 (2006.01); B23K 3/06 (2006.01); B23K 1/00 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
B23K 1/08 (2013.01); B23K 1/0016 (2013.01); B23K 3/0676 (2013.01); H01L 31/022425 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.


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