The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Nov. 25, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Naoki Azuma, Yamanashi, JP;

Masayuki Kuwabara, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); H05K 13/04 (2006.01); B23K 1/00 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B23K 1/005 (2006.01); B23K 3/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); F21V 19/00 (2006.01); G01D 5/26 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); B23K 1/005 (2013.01); B23K 1/0016 (2013.01); B23K 3/00 (2013.01); B23K 3/0638 (2013.01); B23K 3/08 (2013.01); B32B 37/12 (2013.01); B32B 37/1284 (2013.01); B32B 37/18 (2013.01); F21V 19/0025 (2013.01); G01D 5/26 (2013.01); H05K 13/046 (2013.01); B32B 2037/1253 (2013.01); B32B 2310/0806 (2013.01); B32B 2457/00 (2013.01); H05K 13/0015 (2013.01); Y10T 29/53174 (2015.01);
Abstract

In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.


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