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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9572294 B1

PDFFull Text
Date of Patent:
Feb. 14, 2017

Filed:

Oct. 12, 2011

Circuit device and method for manufacturing same

Applicants:

Nobuhisa Onai, Ota, JP;

Masami Motegi, Gunma, JP;

Inventors:

Nobuhisa Onai, Ota, JP;

Masami Motegi, Gunma, JP;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

Rennie William Dover

Primary Examiner:

Stephen Sul

Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 1/02 (2006.01); H01L 21/56 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H05K 3/34 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H01L 21/563 (2013.01); H01L 23/142 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/4334 (2013.01); H01L 24/27 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/0298 (2013.01); H05K 3/341 (2013.01); H05K 3/3484 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/451 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/30107 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10969 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/043 (2013.01); H05K 2203/1476 (2013.01); Y02P 70/613 (2015.11);
Abstract

Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (), which are apart from each other, are firstly formed on the upper surface of a pad (A), and a chip component (B) and a transistor (C) are affixed at the same time. After that, a solder paste () is supplied to the upper surface of the pad (A) using a syringe (), a heatsink (D) is mounted on top of the solder paste (), and melting is caused by a reflow process. There is little risk of sinking of the solders () in the present invention since the solders () are discretely arranged on the upper surface of the pad (A).

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