The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Aug. 27, 2013
Applicant:
Mb-microtec Ag, Niederwangen bei Bern, CH;
Inventors:
Assignee:
MB-Microtec AG, Niederwangen bei Bern, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); B23K 26/21 (2014.01); H05K 5/06 (2006.01); H01L 23/08 (2006.01); H05K 5/00 (2006.01); A61B 1/04 (2006.01); C03B 23/217 (2006.01); C03B 23/24 (2006.01); C03B 33/08 (2006.01); C03B 33/085 (2006.01); G03B 17/08 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); A61B 1/04 (2013.01); C03B 23/217 (2013.01); C03B 23/245 (2013.01); C03B 33/082 (2013.01); C03B 33/0855 (2013.01); G03B 17/08 (2013.01); H01L 21/52 (2013.01); H01L 23/08 (2013.01); H05K 5/0095 (2013.01); H05K 5/03 (2013.01);
Abstract
A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.