The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Jun. 12, 2013
Applicant:
Linxens Holding, Guyancourt, FR;
Inventors:
Séverine Dieu-Gomont, Limietz-Villez, FR;
Francois Lechleiter, Favrieux, FR;
Yannick De Maquillé, Sant-Germain-en-Laye, FR;
Assignee:
Linxens Holding, Guyancourt, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01B 13/00 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); H05K 3/32 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H05K 1/189 (2013.01); H05K 3/002 (2013.01); H05K 3/0017 (2013.01); H05K 3/06 (2013.01); H05K 3/4092 (2013.01); H05K 2201/0397 (2013.01); H05K 2201/10106 (2013.01); Y10T 29/49133 (2015.01);
Abstract
The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.