The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Jun. 20, 2014
Applicant:
Fujitsu Component Limited, Tokyo, JP;
Inventors:
Assignee:
FUJITSU COMPONENT LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); H05K 3/4007 (2013.01); H05K 9/0028 (2013.01); H05K 9/0035 (2013.01); H05K 1/0218 (2013.01); H05K 3/341 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/167 (2013.01); Y10T 29/49144 (2015.01);
Abstract
An electronic component module includes a board having an electronic component mounted on a surface of the board and a shield case mounted on the surface of the board and covering the electronic component. The board includes a projecting part projecting from the surface of the board. The projecting part is formed of plating at a position along a sidewall of the shield case and is soldered to the shield case.