The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Jan. 17, 2012
Applicants:

Chad David Freitag, Portland, OR (US);

Tygh James Newton, Sherwood, OR (US);

Chad Johan Slenes, Sherwood, OR (US);

Inventors:

Chad David Freitag, Portland, OR (US);

Tygh James Newton, Sherwood, OR (US);

Chad Johan Slenes, Sherwood, OR (US);

Assignee:

XEROX CORPORATION, Norwalk, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H05K 3/321 (2013.01); H05K 3/361 (2013.01); H05K 3/363 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09681 (2013.01);
Abstract

An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.


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