The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Jul. 19, 2013
Applicant:
Nec Corporation, Minato-ku, Tokyo, JP;
Inventors:
Akihiro Ueda, Tokyo, JP;
Shinji Tanaka, Tokyo, JP;
Assignee:
NEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 1/024 (2013.01); H05K 3/4626 (2013.01); H05K 2201/0187 (2013.01);
Abstract
Provided is a printed circuit board consisting of laminated substrates each with a fiberglass cloth contained in its resin and with a wiring arranged onto at least one of its surfaces, wherein, in at least one of substrates provided with a wiring for transmitting a higher speed signal than that transmitted by wirings arranged onto the other substrates, a fiberglass cloth having a different property from that of the other substrates is contained.