The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Dec. 23, 2011
Sang Myung Lee, Seoul, KR;
Sung Woon Yoon, Seoul, KR;
Hyuk Soo Lee, Seoul, KR;
Sung Won Lee, Seoul, KR;
Ki DO Chun, Seoul, KR;
Sang Myung Lee, Seoul, KR;
Sung Woon Yoon, Seoul, KR;
Hyuk Soo Lee, Seoul, KR;
Sung Won Lee, Seoul, KR;
Ki Do Chun, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.