The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
May. 29, 2014
Applicant:
Hamamatsu Photonics K.k., Hamamatsu-shi, Shizuoka, JP;
Inventors:
Assignee:
HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 3/14 (2006.01); H04N 5/335 (2011.01); H04N 5/369 (2011.01); H04N 5/32 (2006.01); H04N 5/367 (2011.01); H01L 27/146 (2006.01); H04N 5/374 (2011.01); H04N 5/378 (2011.01);
U.S. Cl.
CPC ...
H04N 5/3698 (2013.01); H01L 27/14603 (2013.01); H01L 27/14609 (2013.01); H01L 27/14618 (2013.01); H01L 27/14632 (2013.01); H01L 27/14658 (2013.01); H01L 27/14663 (2013.01); H04N 5/32 (2013.01); H04N 5/367 (2013.01); H04N 5/369 (2013.01); H04N 5/374 (2013.01); H04N 5/378 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49175 (2013.01);
Abstract
A solid-state imaging device includes a sensor panel section and a readout circuit section. The sensor panel section is disposed on a glass substrate and has a photodetecting section including pixels arrayed in M rows and N columns, row selection lines, and readout lines. The readout circuit section is disposed on a substrate and has N integration circuits. Rectifier circuits are connected between nodes, between N panel-side connection points and the integration circuits, and a constant potential line. Circuit elements having resistance components are connected between the nodes and readout lines.