The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Jun. 25, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Jianjun Guo, Ballston Spa, NY (US);

Brian David Yanoff, Niskayuna, NY (US);

Jonathan David Short, Niskayuna, NY (US);

Biju Jacob, Niskayuna, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); H04N 5/369 (2011.01); H04N 5/378 (2011.01);
U.S. Cl.
CPC ...
H04N 5/369 (2013.01); H04N 5/378 (2013.01);
Abstract

An imager including sub-imager pixel arrays having a plurality of four-side buttable imagers distributed on a substrate and an on-chip digitizing readout circuit. Pixel groupings formed from among the plurality of four-side buttable imagers. The readout electronics including a buffer amplifier for each of the pixel groupings and connected to respective outputs of each four-side buttable imager of the pixel grouping. A plurality of shared analog front ends, each shared analog front end connected to respective multiple buffer amplifiers from among the plurality of pixel groupings. An analog-to-digital converter located at a common centroid location relative to the plurality of shared analog front ends, the analog-to-digital converter having a fully addressable input selection to individually select an output from each of the plurality of shared analog front ends. An output of the analog-to-digital converter connected to a trace on a back surface of the wafer substrate by a through-substrate-via.


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