The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Feb. 07, 2012
Applicants:

Masayuki Kawamura, Yokkaichi, JP;

Masahiro Imai, Yokkaichi, JP;

Naoyuki Ueda, Yokkaichi, JP;

Tomohiro Shibata, Yokkaichi, JP;

Inventors:

Masayuki Kawamura, Yokkaichi, JP;

Masahiro Imai, Yokkaichi, JP;

Naoyuki Ueda, Yokkaichi, JP;

Tomohiro Shibata, Yokkaichi, JP;

Assignee:

Sumitomo Wiring Systems, Ltd, Yokkaichi, Mie, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/64 (2006.01); H01R 43/048 (2006.01); H02G 15/06 (2006.01); H01R 4/18 (2006.01); H01R 43/058 (2006.01);
U.S. Cl.
CPC ...
H01R 43/048 (2013.01); H01R 4/187 (2013.01); H02G 15/06 (2013.01); H01R 4/185 (2013.01); H01R 43/058 (2013.01); Y10T 29/49185 (2015.01); Y10T 29/53235 (2015.01);
Abstract

The present invention aims to maximally reduce a projecting width of a projecting part formed on a terminal when the terminal is crimped to an exposed core part of an end part of a wire. To achieve this aim, a method for producing a terminal-equipped wire in which a crimping portion of a terminal is crimped to an exposed core part of an end part of a wire includes a) a step of arranging the exposed core part in the crimping portion, b) a step of sandwiching a part of the crimping portion between a lower die surface of a lower die and an upper die surface of an upper die and crimping the part of the crimping portion to the exposed core part, and c) a step of pressing an end part of the crimping portion protruding from the upper die surface from above.


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