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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9570718 B1

PDFFull Text
Date of Patent:
Feb. 14, 2017

Filed:

Mar. 19, 2014

Packaging material for batteries

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Yohei Hashimoto, Tokyo, JP;

Rikiya Yamashita, Tokyo, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Brittany Raymond

Int. Cl.
CPC ...
H01M 2/02 (2006.01); B32B 15/08 (2006.01); B32B 27/18 (2006.01); B32B 7/12 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 27/42 (2006.01); B32B 27/08 (2006.01); B32B 27/26 (2006.01);
U.S. Cl.
CPC ...
H01M 2/0292 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/26 (2013.01); B32B 27/308 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 27/42 (2013.01); H01M 2/02 (2013.01); H01M 2/0275 (2013.01); H01M 2/0277 (2013.01); H01M 2/0287 (2013.01); B32B 2264/025 (2013.01); B32B 2264/0292 (2013.01); B32B 2264/10 (2013.01); B32B 2264/108 (2013.01); B32B 2307/714 (2013.01); B32B 2439/00 (2013.01); B32B 2457/10 (2013.01);
Abstract

A packaging material for batteries, which is formed of a laminate that sequentially includes a base layer, an adhesive layer, a barrier layer and a sealant layer in this order. By having the adhesive layer formed of a cured product of a resin composition that contains a thermosetting resin and (A) a curing accelerator and an elastomer resin or (B) reactive resin beads, the adhesive layer arranged between the base layer and the barrier layer can be cured in a short time, thereby reducing the lead time. In addition, by providing the adhesive layer between the base layer and the barrier layer, the adhesion strength between the base layer and the barrier layer is increased and excellent formability can be achieved.

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