The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Jan. 21, 2016
Applicant:

Melexis Technologies SA, Bevaix, CH;

Inventors:

Jian Chen, Helst op den Berg, BE;

Robert Racz, Zug, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 43/04 (2006.01); B29C 45/14 (2006.01); G01R 33/00 (2006.01); H01L 21/56 (2006.01); H01L 25/16 (2006.01); H01L 43/06 (2006.01); H01L 43/12 (2006.01); G01R 33/07 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); B29C 45/14 (2013.01); G01R 33/0047 (2013.01); G01R 33/072 (2013.01); H01L 21/56 (2013.01); H01L 25/16 (2013.01); H01L 43/06 (2013.01); H01L 43/12 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/19105 (2013.01);
Abstract

The invention relates to a method for the production of current sensors which comprise a plastic housing made in an IC technology. The key steps are to mount on a leadframe and wire bond semiconductor chips having Hall sensors, to place the leadframe in an injection mold, to close the injection mold with a first mold insert and to inject plastic material, wherein each semiconductor chip is packed into an intermediate casing including a flat surface having alignment structures. Then the injection mold is opened and a current conductor section is placed on the flat surface of each intermediate casing, the current conductor section having counter structures matching the alignment structures so that it is automatically aligned and held. Then the injection mold is closed with a second mold insert and plastic material injected to form the final housing of the current sensors. It is also possible to use two different injection molds.


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