The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Aug. 21, 2012
Applicants:

Kuo-lung Fang, Zhudong Township, Hsinchu County, TW;

Chi-wen Kuo, Tainan, TW;

Jun-rong Chen, Taichung, TW;

Chih-hao Yang, Taipei, TW;

Inventors:

Kuo-Lung Fang, Zhudong Township, Hsinchu County, TW;

Chi-Wen Kuo, Tainan, TW;

Jun-Rong Chen, Taichung, TW;

Chih-Hao Yang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/50 (2010.01); H01L 33/06 (2010.01); H01L 33/00 (2010.01); H01L 33/08 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 33/0079 (2013.01); H01L 33/06 (2013.01); H01L 33/50 (2013.01); H01L 33/505 (2013.01); H01L 33/08 (2013.01);
Abstract

A method for fabricating a light-emitting device is provided. The method includes: providing a substrate; forming a sacrificial dielectric layer on the substrate, wherein the sacrificial dielectric layer is a structure containing voids; forming a buffer layer on the sacrificial dielectric layer; forming an epitaxial light-emitting structure on the buffer layer; forming a metal bonding layer on the epitaxial light-emitting structure; bonding the metal bonding layer to a thermally conductive substrate; and wet etching the sacrificial dielectric layer for to remove the substrate.


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