The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Dec. 03, 2012
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Hideki Matsui, Tokyo, JP;

Kosuke Saeki, Tokyo, JP;

Yasushi Shirahige, Tokyo, JP;

Noritoshi Akazawa, Tokyo, JP;

Toshio Yoshihara, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/04 (2014.01); C09D 123/08 (2006.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0481 (2013.01); C09D 123/0815 (2013.01); C08L 2203/204 (2013.01); C08L 2205/025 (2013.01); C08L 2207/06 (2013.01); C08L 2312/08 (2013.01); C08L 2314/06 (2013.01); Y02E 10/50 (2013.01);
Abstract

Provided is a sealing material sheet for solar cell modules, which is obtained by irradiating a polyethylene resin with ionizing radiation and has high transparency, heat resistance and adhesion at the same time. This sealing material sheet for solar cell modules contains a low density polyethylene having a density of 0.900 g/cmor less, while having a gel fraction of from 0% to 40% (inclusive) and a degree of dispersity (Mw/Mn), which is the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) in terms of polystyrene, of from 2.5 to 3.5 (inclusive).


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