The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Apr. 07, 2016
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Koichi Toba, Tokyo, JP;

Hiraku Chakihara, Tokyo, JP;

Yoshiyuki Kawashima, Tokyo, JP;

Kentaro Saito, Tokyo, JP;

Takashi Hashimoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/285 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 21/3105 (2006.01); H01L 27/092 (2006.01); H01L 29/423 (2006.01); H01L 27/115 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7847 (2013.01); H01L 21/28282 (2013.01); H01L 21/28518 (2013.01); H01L 21/3105 (2013.01); H01L 21/823412 (2013.01); H01L 21/823418 (2013.01); H01L 21/823468 (2013.01); H01L 27/0922 (2013.01); H01L 27/1157 (2013.01); H01L 27/11573 (2013.01); H01L 29/4234 (2013.01); H01L 29/42324 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01);
Abstract

To improve a semiconductor device having a nonvolatile memory. A first MISFET, a second MISFET, and a memory cell are formed, and a stopper film made of a silicon oxide film is formed thereover. Then, over the stopper film, a stress application film made of a silicon nitride film is formed, and the stress application film over the second MISFET and the memory cell is removed. Thereafter, heat treatment is performed to apply a stress to the first MISFET. Thus, a SMT is not applied to each of elements, but is applied selectively. This can reduce the degree of degradation of the second MISFET due to H (hydrogen) in the silicon nitride film forming the stress application film. This can also reduce the degree of degradation of the characteristics of the memory cell due to the H (hydrogen) in the silicon nitride film forming the stress application film.


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