The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Dec. 18, 2015
Applicants:

Hyo Seok Woo, Hwaseong-si, KR;

IN MO Kim, Hwaseong-si, KR;

Bora Lee, Incheon, KR;

Sun Young Kim, Seongnam-si, KR;

Hoo Sung Cho, Yongin-si, KR;

Inventors:

Hyo Seok Woo, Hwaseong-si, KR;

In Mo Kim, Hwaseong-si, KR;

Bora Lee, Incheon, KR;

Sun Young Kim, Seongnam-si, KR;

Hoo Sung Cho, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); G01R 31/28 (2006.01); H01L 23/485 (2006.01); G01R 1/067 (2006.01); H01L 27/105 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1052 (2013.01); H01L 22/32 (2013.01); H01L 23/5226 (2013.01); H01L 24/09 (2013.01); H01L 2224/08055 (2013.01); H01L 2224/09055 (2013.01);
Abstract

A semiconductor device includes a plurality of semiconductor devices, a plurality of metal lines electrically connected to at least one of the semiconductor devices, and a protective layer on the metal lines. The protective layer includes a plurality of open areas partially exposing the metal lines and which serves as pads. A first pad includes a first area that extends from at least one of the metal lines and at least one second area around and separated from the first area.


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