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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9570384 B1

PDFFull Text
Date of Patent:
Feb. 14, 2017

Filed:

Aug. 05, 2015

Semiconductor device

Applicant:

Hewlett-packard Development Company, L.p., Fort Collins, CO (US);

Inventors:

Lawrence H. White, Corvallis, OR (US);

Robert Vina, Corvallis, OR (US);

Terry Mcmahon, Corvallis, OR (US);

James R. Przybyla, Corvallis, OR (US);

Assignee:

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Houston, TX (US);

Attorney:

Thorpe, North & Western LLP

Primary Examiner:

Dzung Tran

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/552 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/76838 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05013 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/05092 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/04642 (2013.01); H01L 2924/059 (2013.01); H01L 2924/0534 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/05994 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

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