The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Sep. 04, 2014
Applicant:
Ampleon Netherlands B.v., Nijmegen, NL;
Inventors:
Freek Egbert van Straten, Mook, NL;
Jeremy Joy Montalbo Incomio, Santa Rosa City, PH;
Albertus Reijs, Molenhoek, NL;
Assignee:
Ampleon Netherlands B.V., Nijmegen, NL;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/566 (2013.01); H01L 23/4334 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49544 (2013.01); H01L 23/49861 (2013.01); H01L 2924/1815 (2013.01);
Abstract
For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.