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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9570222 B1

PDFFull Text
Expired
Date of Patent:
Feb. 14, 2017

Filed:

Jul. 31, 2013

Vector inductor having multiple mutually coupled metalization layers providing high quality factor

Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Dev V. Gupta, Acton, MA (US);

Mehdi Si Moussa, Acton, MA (US);

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:

Nixon Peabody LLP

Primary Examiner:

Robert Pascal

Assistant Examiner:

Rakesh Patel

Int. Cl.
CPC ...
H03H 7/09 (2006.01); H01F 17/00 (2006.01); H03H 7/01 (2006.01); H03H 7/38 (2006.01); H01G 5/38 (2006.01); H01G 4/38 (2006.01); H01L 23/64 (2006.01); H01L 27/08 (2006.01); H01G 4/40 (2006.01); H03H 5/00 (2006.01); H03H 7/48 (2006.01); H03H 11/12 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01G 5/38 (2013.01); H01L 23/642 (2013.01); H01L 27/0811 (2013.01); H03H 7/01 (2013.01); H03H 7/0115 (2013.01); H03H 7/0138 (2013.01); H03H 7/09 (2013.01); H03H 7/38 (2013.01); H01F 2017/0026 (2013.01); H01L 28/10 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15311 (2013.01); H03H 5/003 (2013.01); H03H 7/0153 (2013.01); H03H 7/48 (2013.01); H03H 11/1291 (2013.01); H03H 2210/025 (2013.01); H03H 2210/036 (2013.01); H03H 2240/00 (2013.01);
Abstract

An inductor component includes a plurality of conductive elements, each formed as an individual patch of conductive material, with the conductive elements arranged in a vertical stack and tightly coupled to one another. Dielectric is disposed between more adjacent conductive elements, the dielectric has a permittivity and is sufficiently thin so as to provide a mutual inductance factor of at least one-half or greater between adjacent ones of the conductive elements. The dielectric is typically thinner than the adjacent conductors.

Find Patent Forward Citations

Gupta, Dev. (2017). Vector inductor having multiple mutually coupled metalization layers providing high quality factor (U.S. Patent No. 9570222). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9570222

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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