The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Oct. 31, 2013
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Inventors:

Daiki Nakamura, Kanagawa, JP;

Yusuke Kubota, Kanagawa, JP;

Yusuke Nishido, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1339 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01); G02F 1/1345 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1339 (2013.01); H01L 51/5246 (2013.01); G02F 1/13338 (2013.01); G02F 1/13452 (2013.01); H01L 27/3276 (2013.01);
Abstract

A sealed body which is sealed with low-melting-point glass and has high airtightness is provided. In the sealed body, at least a wiring layer is provided between two facing substrates, the two substrates are bonded together with the use of a sealing layer containing glass frits as a material, and a metal layer is selectively provided in a region where the wiring layer and the sealing layer overlap. In a laser light irradiation step, the metal layer functions as a laser light reflecting film and suppresses application of excess energy to a sealing member in a region overlapping with the wiring layer.


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