The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Sep. 30, 2014
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Frank Mayer, Vaihingen/Enz, DE;
Juergen Jerg, Ofterdingen, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 21/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
F28F 21/00 (2013.01); H05K 7/20472 (2013.01); H05K 1/0206 (2013.01);
Abstract
A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance.