The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Feb. 27, 2015
Ngk Insulators, Ltd., Nagoya, JP;
Mitsuhiro Ito, Nagoya, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
There is provided a honeycomb structure where a crack at a honeycomb substrate is reduced. A honeycomb structure has a honeycomb substrate that has a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and an outer circumference coating layer disposed at an outer circumference of the honeycomb substrate. At 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate. The thermal expansion coefficients of the outer circumference coating layer and the thermal expansion coefficient at 25 to 800° C. preferably meet a relationship represented by the expression: 1.1<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the honeycomb substrate)<40.