The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Feb. 20, 2014
Applicant:

University of Southern California, Los Angeles, CA (US);

Inventors:

Gang Zhang, Monterey Park, CA (US);

Adam L. Cohen, Dallas, TX (US);

Michael S. Lockard, Lake Elizabeth, CA (US);

Ananda H. Kumar, Fremont, CA (US);

Ezekiel J. J. Kruglick, San Diego, CA (US);

Kieun Kim, Pasadena, CA (US);

Assignee:

University of Southern California, Los Angeles, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/50 (2006.01); C25D 1/00 (2006.01); C25D 5/14 (2006.01); C25D 5/34 (2006.01); C25D 5/40 (2006.01); H01L 21/288 (2006.01); C25D 5/02 (2006.01); C25D 5/48 (2006.01); C25D 5/10 (2006.01); H01L 21/768 (2006.01); H05K 3/24 (2006.01); C25D 5/12 (2006.01); C25D 5/18 (2006.01);
U.S. Cl.
CPC ...
C25D 5/50 (2013.01); C25D 1/003 (2013.01); C25D 5/022 (2013.01); C25D 5/10 (2013.01); C25D 5/14 (2013.01); C25D 5/18 (2013.01); C25D 5/34 (2013.01); C25D 5/40 (2013.01); C25D 5/48 (2013.01); H01L 21/2885 (2013.01); H01L 21/76879 (2013.01); C25D 5/12 (2013.01); H05K 3/241 (2013.01); H05K 3/243 (2013.01);
Abstract

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.


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