The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Aug. 17, 2015
Texas Instruments Incorporated, Dallas, TX (US);
John Charles Ehmke, Garland, TX (US);
Virgil Cotoco Ararao, McKinney, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A hermetic package comprising a substrate () having a surface with a MEMS structure () of a first height (), the substrate hermetically sealed to a cap () forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack () of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (); the stack having a bottom first metal seed film () adhering to the substrate and a bottom second metal seed film () adhering to the bottom first seed film, both seed films of a first width () and a common sidewall (); further a top first metal seed film () adhering to the cap and a top second metal seed film () adhering to the top first seed film, both seed films with a second width () smaller than the first width and a common sidewall (); the bottom and top metal seed films tied to a metal layer () including gold-indium intermetallic compounds, layer () having a second height () greater than the first height and encasing the seed films and common sidewalls.