The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Feb. 10, 2016
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Takeshi Shibata, Yokohama, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1632 (2013.01); B41J 2/16 (2013.01); B41J 2/162 (2013.01); B41J 2/1634 (2013.01); H01L 21/78 (2013.01);
Abstract
There is provided a method for manufacturing semiconductor chips in which the chips as many as possible are arranged on one substrate and these chips can be cut with high accuracy in a relatively simple process. For such occasion on a wafer, short sides of the semiconductor chips are laid out to be inclined at an angle of 5° or less to a crystal orientation of the wafer. Thereafter, a laser stealth dicing method is used to form a plurality of first dicing lines along long sides of the individual semiconductor chips and a plurality of second dicing lines along short sides thereof.