The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Oct. 04, 2013
Applicant:
Nok Corporation, Tokyo, JP;
Inventors:
Akihiro Suzuki, Kanagawa, JP;
Kiyofumi Fukasawa, Kanagawa, JP;
Assignee:
NOK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/10 (2006.01); B32B 25/08 (2006.01); B32B 25/14 (2006.01); B32B 27/16 (2006.01); B32B 27/34 (2006.01); B32B 1/08 (2006.01); C08J 7/12 (2006.01); B32B 25/20 (2006.01); C08J 7/04 (2006.01);
U.S. Cl.
CPC ...
B32B 25/08 (2013.01); B32B 25/14 (2013.01); B32B 25/20 (2013.01); B32B 27/16 (2013.01); B32B 27/34 (2013.01); C08J 7/047 (2013.01); C08J 7/123 (2013.01); B32B 1/08 (2013.01); B32B 7/10 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2310/14 (2013.01); B32B 2605/00 (2013.01); C08J 2377/02 (2013.01); C08J 2377/06 (2013.01); C08J 2427/16 (2013.01); Y10T 428/31544 (2015.04);
Abstract
A resin-rubber composite in which a low-pressure plasma-treated polyamide-based resin-molded product and a polyol-vulcanizable fluororubber composition that forms a fluororubber layer are directly bonded by vulcanization without interposing an adhesive. The low-pressure plasma treatment of the polyamide-based resin-molded product is performed in the presence of an inert gas, such as He gas, Ar gas, or Ngas, at a pressure of 10 to 1,000 Pa. Here, an alkoxysilane compound is an optional component in the fluororubber composition, and the presence or absence of this compound does not affect the adhesion.