The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Mar. 12, 2012
Applicant:
Masato Ota, Yokohama, JP;
Inventor:
Masato Ota, Yokohama, JP;
Assignee:
BRIDGESTONE CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/20 (2006.01); B29D 99/00 (2010.01); B29C 44/12 (2006.01); B29C 44/58 (2006.01); B60N 2/70 (2006.01); A47C 7/18 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29D 99/0092 (2013.01); A47C 7/18 (2013.01); B29C 44/1252 (2013.01); B29C 44/583 (2013.01); B29C 44/588 (2013.01); B60N 2/7017 (2013.01); B29L 2031/771 (2013.01); Y10T 428/24273 (2015.01);
Abstract
Provided is a method for producing a foamed synthetic resin molded body. In this method, in the case where a hole-like portion is a through hole, when foam molding is performed, the occurrence of molding defects such as voids at the periphery of the hole-like portion can be sufficiently prevented or suppressed without forming a burr portion that closes the hole-like portion. Also in this method, in the case where the hole-like portion is a non-through hole, the occurrence of molding defects such as voids at a bottom portion of the hole-like portion can be sufficiently prevented or suppressed.