The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Oct. 20, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuki Nakagawa, Utsunomiya, JP;

Noriyasu Hasegawa, Utsunomiya, JP;

Yosuke Murakami, Utsunomiya, JP;

Takahiro Matsumoto, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41L 35/14 (2006.01); B29C 59/02 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); B29C 59/16 (2006.01); B29K 101/00 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B29C 59/16 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); B29K 2101/00 (2013.01); B29L 2009/00 (2013.01); B29L 2031/34 (2013.01);
Abstract

An imprint method of forming a pattern of a resin on a substrate held on a holding surface. An uncured resin on the substrate is brought in contact with a mold. A partial region of the substrate is thermally deformed by irradiating the region with light so as to change an outer circumferential shape of the region. The uncured resin is cured on the region by irradiating light having a wavelength different from the deforming light. The mold is released from the cured resin on the region in contact with the mold. In at least a portion of a period during the deforming step, a region different from the region is held at a first suction force, while the region is held at a second suction force less than the first. The first suction force and the second suction force act between the substrate and the holding surface.


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