The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Apr. 13, 2012
Applicants:

Metin Sitti, Pittsburgh, PA (US);

Paul Samuel Glass, Pittsburgh, PA (US);

Burak Aksak, Lubbock, TX (US);

Inventors:

Metin Sitti, Pittsburgh, PA (US);

Paul Samuel Glass, Pittsburgh, PA (US);

Burak Aksak, Lubbock, TX (US);

Assignee:

NANOGRIPTECH, INC., Pittsburgh, PA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/38 (2006.01); B29C 37/00 (2006.01); B29C 59/02 (2006.01); B29C 45/37 (2006.01); B29C 33/42 (2006.01); B29C 45/26 (2006.01); B29L 31/00 (2006.01); B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
B29C 33/3857 (2013.01); B29C 33/424 (2013.01); B29C 37/0053 (2013.01); B29C 45/26 (2013.01); B29C 45/372 (2013.01); B29C 59/022 (2013.01); B29C 43/021 (2013.01); B29C 2059/023 (2013.01); B29L 2031/756 (2013.01); B29L 2031/757 (2013.01); B29L 2031/7562 (2013.01); Y10T 428/24479 (2015.01);
Abstract

The present invention is a method that (i) allows for creating micro and/or nanostructures on either planar or non-planar three-dimensional surfaces in a single molding step, and (ii) allows for the molded production of complex high-aspect ratio micro and/or nanostructures including but not limited to cylinders, conical structures, low aspect-ratio channels, bumps, or posts. An example of such a complex structure are high aspect ratio pillars with enlarged 'mushroom-shaped' or undercut tips which demonstrate enhanced, repeatable adhesion and shear strength on a variety of substrates when compared with other micro and/or nanostructures and unstructured materials. The mold of such a material requires an 'undercut' feature that cannot be produced using typical micro/nano-molding processing techniques.


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